Thermal Simulation/packaging Engineer

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Diraq is redefining scalable quantum computing by enabling millions of qubits on a single chip – far beyond the hundreds available today – to unlock practical, commercial quantum applications.
We are building a full-stack quantum computing company, delivering quantum hardware and software as a cloud-accessible service.
Our proprietary technology, backed by over 20 years of research and more than $150 million in grant and venture capital funding, and protect by 11 patent families, leverages existing silicon CMOS manufacturing and foundries to accelerate development and reduce costs – paving a faster, more efficient path to market.
We are a team of world-leading scientists, engineers, and business professionals.
With a strong IP portfolio and partnerships with global technical and commercial leaders, we are shaping the quantum ecosystem of the future and driving meaningful impact across the entire industry.
Diraq is a global business with teams located in Sydney, Australia, and Palo Alto and Boston, United States.
Our presence across these key locations enables us to access top-tier talent and collaborate closely with leading research institutions, government agencies, and commercial partners.
About you Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, or related field.
Experience in IC packaging in the semiconductor industry.
Familiarity with cryogenic and advanced packaging is highly desirable.
Proficiency in thermal simulation tools such as COMSOL, MATLAB or ANSYS.
Hands-on experience designing PCBs and understanding system thermal profiles.
Exposure to high-performance computing (HPC) or cryogenic systems is a plus.
Strong communication skills and ability to work in a startup environment with cross-functional teams.
About the role We're building the future of quantum computing, and we need your expertise to help us scale our processor packaging to enable high-performance quantum systems.
You'll be at the intersection of thermal engineering, package design, and the semiconductor industry —working closely with system engineers, IC designers, and experimentalists to bring our quantum computers to life.
Design and model packaging solutions for cryogenic performance, including mechanical components and PCBs.
Develop and validate thermal management strategies for chips operating in cryogenic environments.
Collaborate with system engineers and IC designers to define packaging requirements and specifications.
Work with experimentalists to verify and validate packaging designs through hands-on testing.
Align with industry partners and stay up to date on best practices in thermal simulation and latest packaging technologies.
Contribute to project collaborations with semiconductor R&D organisations.
Support the transition of packaging designs into front-line cryogenic systems.
Contribute to the design of system architecture, PCBs and chip layouts with a focus on thermal and mechanical integrity.
Why work for us Gorgeous central Sydney CBD office location Paid time off to volunteer for a cause you're passionate about Opportunity to work with a talented team of professionals and world experts in the quantum computing field and a distinguished senior leadership team and Board A dynamic, supportive, and innovative work environment with opportunities for personal and professional growth We've got this one covered No need for recruitment help — unsolicited CVs or agency contact won't be considered.
Seniority level Seniority level Associate Employment type Employment type Full-time Job function Job function Engineering and Information Technology Industries Semiconductor Manufacturing Referrals increase your chances of interviewing at Diraq by 2x Get notified about new Packaging Engineer jobs in Sydney, New South Wales, Australia .
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